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Stion Announces $130M Financing
2011-12-20
SAN JOSE, CA, Leading manufacturer of high-efficiency thin-film solar modules announced a $130M equity investment led by AVACO and Korean private equity funds. Existing investors Khosla Ventures, Taiwan Semiconductor (through VentureTech Alliance), Lightspeed, Braemar Energy Ventures, and General Catalyst all participated in the round.
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Aviir Announces $30M Finance Agreement
2011-12-20
IRVINE, CA, Biotechnology company specializing in cardiac disease assessment announced that it entered into an agreement with multiple investors to raise up to $30 million in the company's latest financing round. Merck Global Health Innovation Fund led the round.
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BestVendor Secures $3M in Series A
2011-12-20
NEW YORK, NY, New online resource where professionals discover and share work-related applications announced that it has secured $3 million in Series A funding co-led by RRE Ventures and SoftBank Capital.
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eRecyclingCorps Secures $35M
2011-12-20
IRVING, TX, Partner to global wireless carriers and retailers in the management of wireless e-waste as an asset, raised $35 million in a fundraising round led by Kleiner Perkins Caufield and Byers.
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LogoGarden Closes $2M
2011-12-20
NASHVILLE, TN, Online service which provides entrepreneurs with do-it-yourself (DIY) logo design, "branding essentials" and custom design options, has closed on a $2 million financing deal from FCA Venture Partners.
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Excelimmune Snares $12M
2011-12-20
WOBURN, MA, Excelimmune announced that the company has raised $12 million from a private investor. Proceeds will be used by Excelimmune to develop its infectious disease programs.
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appssavvy Secures $7.1M Series 1-A
2011-12-20
NEW YORK, NY, Activity advertising technology company announced the completion of its $7.1 million Series 1-A venture capital round. Participants in the offering included True Ventures, The New York Times Company, and AOL Ventures.
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Razer Inks $50M Financing
2011-12-20
CARLSBAD, CA, Leader in high performance gaming hardware announced it has secured a $50 million round led by IDG-Accel China Capital Fund.
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EnVerv Closes $12M Series B
2011-12-20
SAN JOSE, CA, Fabless semiconductor company developing high performance Communications System on Chip (SoC) solutions for the Smart Grid market announces the closing of $12M Series B round of funding led by Benchmark Capital. Previous investors, NEA and Walden International participated in the round also.
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