TYLsemi is the first chiplet platform company to deliver a full portfolio across IO, power delivery, and memory paired with a chiplet-based custom silicon design, integration and supply-chain ownership. This standards-based, production-ready portfolio will provide AI infrastructure customers with a faster, lower-risk path for developing AI silicon from architecture to deployment.

The funding round was led by Matter Venture Partners with participation from Viola Ventures, GHOVC, Egis Technology, and strategic investment from leading companies across the global semiconductor and AI infrastructure ecosystem. The company was co-founded by industry leaders Mohit Gupta and Sunil Bhardwaj, who have led and scaled businesses and worldwide engineering and operations teams at Alphawave (acquired by Qualcomm), SiFive, Cadence Design Systems, Rambus, and other leading semiconductor companies.

TYLsemi is redefining how AI infrastructure silicon is built by delivering standards-based, production-ready chiplets purpose-built for modern multi-die systems. By combining chiplet design, packaging, integration and production expertise, TYLsemi provides a scalable, low-risk path to deploying advanced AI infrastructure. Customers can use TYLsemi chiplets as standalone components or as the foundation for full custom silicon. TYLsemi is expanding teams across silicon design, packaging, and systems engineering.